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Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors

China Dongguan Ziitek Electronic Materials & Technology Ltd. Certificações
China Dongguan Ziitek Electronic Materials & Technology Ltd. Certificações
A almofada condutora térmica é de vista e de trabalho muito bom. Nós não temos nenhuma necessidade para a outra almofada condutora térmica agora!

—— Peter Goolsby

Eu tinha cooperado com o Ziitek por 2 anos, forneceram os materiais condutores térmicos de alta qualidade, e a entrega a tempo, recomenda seus materiais da mudança de fase

—— Antonello Sau

Boa qualidade, bom serviço. Sua equipe dá-nos sempre a ajuda e a resolução, esperança que nós seremos bom sócio todo o tempo!

—— Chris Rogers

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Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors

Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors

Imagem Grande :  Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors

Detalhes do produto:
Lugar de origem: China
Marca: ZIITEK
Certificação: UL and RoHs
Número do modelo: TIF700M
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 unidades
Preço: Negociável
Detalhes da embalagem: 1000pcs/bolsa
Tempo de entrega: 3-5 dias
Habilidade da fonte: 100000pcs/dia
Descrição de produto detalhada
Nome do produto: Almofada térmica de silicone de alta temperatura do fabricante da almofada térmica para processadore Dureza: 60 costa00
Densidade (g/cm³): 3.4 Constante dielétrica @1MHz: 4.2
Amostra: Amostra grátis Cor: Cinza
Condutividade Térmica: 6,0 W/m-K Palavras-chave: Almofada térmica
Aplicação: Servidores de IA Processadores de IA

Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors

 

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


The TIF®700M Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.
 
Features:

> High thermal conductivity: 6.0W/mK

> Good flexibility and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability


Applications

 

>  AI Servers, Inverters, Telecom Devices

>  Power tools
>  Network communication products
>  Electric vehicle batteries Computer CPU/GPU Cooling
>  New energy vehicle power systems

>  Signal communication
>  New energy vehicle
>  Motherboard chip
>  Radiator

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power

> Auditioning electronic products
> Unmanned aerial vehicle(UAV)
> Photovoltaic

Typical Properties of TIF®700M Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.75)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness 60 Shore 00 50 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.2 MHz ASTM D150
Volume Resistivity >1.0X1013 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.0 W/m-K ASTM D5470

6.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.020"(0.5 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:

 

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010" to 0.020" (0.25mm to 0.50mm)

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Thermal Pad Manufacturer High Temperature Silicon Thermal Pad For AI Servers AI Processors 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: 18153789196

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