Brief: Discover the 2W/MK Thermal Conductive Silicone Pad, designed for efficient heat dissipation in CPUs, GPUs, and radiators. This high-performance pad offers excellent thermal conductivity, electrical isolation, and durability, making it ideal for various electronic applications.
Related Product Features:
Good thermal conductivity: 2.0W/mK for efficient heat dissipation.
Naturally tacky surface eliminates the need for additional adhesive.
Soft and compressible for low-stress applications.
Available in various thicknesses to suit different needs.
Easy release construction for hassle-free installation.
Electrically isolating for safe use in electronic devices.
High durability ensures long-lasting performance.
Compliant with UL94 V-0, SGS, and ROHS standards.
Perguntas Frequentes:
What is the thermal conductivity of the TIF™160-20-50E pad?
The TIF™160-20-50E pad has a thermal conductivity of 2.0W/mK, ensuring efficient heat dissipation.
Is the thermal pad electrically isolating?
Yes, the pad is electrically isolating, making it safe for use in electronic applications.
What thicknesses are available for the thermal pad?
The pad is available in thicknesses ranging from 0.020" (0.51mm) to 0.200" (5.08mm), with custom options available upon request.