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Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

Certificado
China Dongguan Ziitek Electronic Materials & Technology Ltd. Certificações
China Dongguan Ziitek Electronic Materials & Technology Ltd. Certificações
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Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies
Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

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Detalhes do produto:
Lugar de origem: China
Marca: ZIITEK
Certificação: UL and RoHs
Número do modelo: TIF100-50-50S
Documento: TIF100-50-50S_Data Sheet.pdf
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1000 unidades
Preço: Negociável
Detalhes da embalagem: 1000 unidades/saco
Tempo de entrega: 3-5 dias de trabalho
Termos de pagamento: T/T
Habilidade da fonte: 10000/dia

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For In Compact Electronic Assemblies

descrição
Nome dos produtos: Preenchimento de lacunas térmicas que fornece propriedades de transferência de calor, isolamento e v Grossura: 0,010"~0,200"(0,25~5,0mm)
Palavras-chave: Preenchimento de lacunas térmicas Dureza: 65/45 Costa 00
Construção: Elastômero de silicone preenchido com cerâmica Densidade: 3.3 g/cm3
Aplicativo: Propriedades de transferência de calor, isolamento e vedação para conjuntos eletrônicos compactos Condutividade Térmica: 5,0 W/mK

Thermal Gap Filler Providing Heat Transfer And Insulation And Sealing Properties For Compact Electronic Assemblies
Product Overview

The TIF®100-50-50S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Key Features
  • Good thermal conductivity: 5.0 W/mK
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Easy release construction
  • Electrically isolating
  • High durability
Applications
  • Cooling components to the chassis or frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Notebook computers
  • Power supply units
  • Heat pipe thermal solutions
  • Memory modules
  • Mass storage devices
  • Automotive electronics
  • Set top boxes
Technical Specifications of TIF®100-50-50S Series
Property Value Test Method
Color Pink Visual
Construction Ceramic filled silicone elastomer -
Density (g/cm³) 3.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 / 0.030~0.200
0.25~0.50 / 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Operating Temperature (℃) -40 to 200℃ -
Breakdown Voltage (V/mm) ≥ 5500 ASTM D149
Dielectric Constant @1Mhz 7.5 ASTM D150
Volume Resistivity (Ohm-meter) ≥1.0×10¹² ASTM D257
Thermal Conductivity (W/m-K) 5.0 ASTM D5470 / ISO22007
Fire Rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm × 406 mm)

Component Codes:

  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

TIF® 100-50-50S Series Thermal Gap Filler Product Image
Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time:

Quantity: 5,000 pieces
Estimated Time: To be negotiated

Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006 as a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. Our product portfolio includes heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad, heat-conducting grease, heat-conducting plastic, silicone rubber, and silicone rubber foam.We adhere to the business philosophy of "survival by quality, development by quality," and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications
ISO9001:2015 ISO14001:2004 IATF16949:2016 IECQ QC 080000:2017 UL

Contacto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Pessoa de Contato: Dana Dai

Telefone: +86 18153789196

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