Manufacturer Customized Thermal Conductive Silicon Pad Thermal Conductive Silicone Thermal Heating Pad For Insulation And Buffering

Manufacturer Customized Thermal Conductive Silicon Pad Thermal Conductive Silicone Thermal Heating Pad For Insulation And Buffering

The TIF^®100-05UF Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Good thermal conductive: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Product Specification

Product Thicknesses: 0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.