A almofada condutora térmica é de vista e de trabalho muito bom. Nós não temos nenhuma necessidade para a outra almofada condutora térmica agora!
—— Peter Goolsby
Eu tinha cooperado com o Ziitek por 2 anos, forneceram os materiais condutores térmicos de alta qualidade, e a entrega a tempo, recomenda seus materiais da mudança de fase
—— Antonello Sau
Boa qualidade, bom serviço. Sua equipe dá-nos sempre a ajuda e a resolução, esperança que nós seremos bom sócio todo o tempo!
—— Chris Rogers
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40 shore a heat absorbing material fabricação online
Fiberglass Reinforced Thermal Gap Pad,Shock Absorbing,Automotive Electronics,1.8 W/m-K,-40 to 160℃ The TIF1180-18-01US is recommended for applications that require a minimum amount of pressure on components. ... Leia mais
-40 to 160℃ low cost insulation silicone pad for LED Ceilinglamp,20 Shore 00 The TIF180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature ... Leia mais
4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast... Leia mais
Thermal conductive gap pad for semiconductor automated test equipment (ATE),20±5 Shore 00,3.0 W/m-K The TIF1120-30-11US is recommended for applications that require a minimum amount of pressure on components. ... Leia mais
4.5mmT,20±5 Shore 00 Good performance thermal conductive pad for Automotive engine control units, The TIF1180-30-11US is recommended for applications that require a minimum amount of pressure on components. The ... Leia mais
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Leia mais
soft thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements The TIF3140 Series is recommended for applications that require a minimum amount of pressure on ... Leia mais
Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The ... Leia mais
Two Component Thermally Conductive Wave Absorbing Gel For Battery Management System In New Energy Vehicles Company Profile Dongguan Ziitek Electronic Material and Technology Co., Ltd. is a professional ... Leia mais
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... Leia mais